- Advanced Interconnect Technologies Manufacturer of High Performance Anodized Aluminum IC Packaging Materials including our MQUAD(Metal QFP) package, DISSIPATOR exposed heatspreader and our TBGA(Tape BGA) Heatsink/Stiffener.
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Facilities Program Manager
with semiconductor experience
Field Applications Engineers
Taiwan, China, Japan, India, San Diego
Process Engineer
Mountaintop, PA
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San Jose
Customer Engineer I 6210
TEXAS CE - Technical Support
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Santa Clara
College Interns 1000
Applied Materials
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