- Veeco for advanced packaging applications provide fast, non-contact analysis of flip-chip solder bumps and advanced interconnect features on silicon wafers and organic substrates
- Kyocera Ceramic technology has distinct advantages over organic materials for flip chip technology. Kyocera has been manufacturing ceramic flip chip substrates since the mid 1980s. Our products have been qualified by many customers for use in a broad scope of applications, including those requiring mil-spec compliance.
- AnoTech is the Flip Chip Bonding manufacturing division of Anorad, the leader in linear motor technology. AnoTech develops and markets high accuracy IC assembly systems for the semiconductor and Flat Panel Display industries utilizing Anorad motion systems and AnoTech high performance process technology.
- IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.
- IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.
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