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Semiconductor Test, Assembly & Packaging :IC Device Packaging :Package Assembly
     

  • Advanced Interconnect Technologies Manufacturer of High Performance Anodized Aluminum IC Packaging Materials including our MQUAD(Metal QFP) package, DISSIPATOR exposed heatspreader and our TBGA(Tape BGA) Heatsink/Stiffener.  

  • Die-Tech builds solutions to connection problems for manufacturers who are committed to continuous improvement of their process and product. As a vertically integrated company, Die-Tech has been a long-time leader in precision metal stampings, specializing in the design and manufacture of lead frames and lead assembly equipment. Die-Tech's automation group provides application equipment from hand tools to fully automatic manufacturing lines. Other services are product design and prototyping, connector assembly and contract manufacturing of microelectronic packages.  

  • Pantronix Corporation quickly became a leader in Hi-Rel and commercial custom packaging services for the semiconductor industry. Pantronix (PTX) grew in both depth and breadth in the ensuing years to our present level where our highly trained employees occupy an 87,000 square foot ISO 9002 certified facility. PTX offers quick turn and production die packaging in over 200 package types (both hermetic and plastic)  


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