- F&K Delvotec F&K Delvotec offers a complete range of die and wire bonders for the production of discrete devices, complex ICs, hybrid systems and multi-chip modules (MCM) as well as the latest chip-on-board (COB) applications.
- Gaiser Tools Gaiser Tools Wire Bondings: Fine Pitch capillaries, Ball Bonding, Wedge bonding.....
- IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.
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Taiwan, China, Japan, India, San Diego
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Mountaintop, PA
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Santa Clara
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Applied Materials
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