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Semiconductor Test, Assembly & Packaging :IC Device Packaging :Die Bonding
     

  • Bondline Electronic Adhesives is a U.S. based manufacturer of premixed and film adhesives for: Electronics , Disk Drives , Chip Scale .  

  • Johnson Matthey Electronics About 60 percent of the Division's sales are concentrated in the assembly materials market, primarily to manufacturers of ASICs and microprocessors. The product line includes die attach materials, soft solders, temperature measurement devices, thermocouples, heat sinks, heat spreaders and slugs, seal lids, and contract manufacturing.  

  • IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.  

  • IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.  


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