- ESEC Group As a leading manufacturer of Die and Wire Bonders and as the only supplier of fully-automated assembly lines, the company plays a major role in shaping the technological standards of its markets. The ESEC Group is market leader worldwide with assembly systems, which provides solutions for future technologies such as chip scale packaging and flip chip applications.
- Quantum Materials (QMI), Q-BOND is a patent pending liquid bismaleimide resin designed for use as a polymeric modifier that exhibits excellent thermal and moisture resistance properties. The resin is compatible with numerous other polymer systems and can be cured with a variety of chemical curatives. Q-BOND will also UV cure with out the addition of a photoinitiator.
- BL Enterprises Offering Thin Film Deposition, Sputtering Systems, Lappers / Polishers, Semiconductor equipment...Surface Inspection...
- Xiris Automation has been developing, designing and installing image processing equipment for the electronics, automotive and semi-conductor manufacturing industries for real-time inspection and measurement applications.
- Fancort Industries The equipment is for two distinct areas of manufacturing--circuit board assembly and semiconductor assembly.
- ETC Semiconductor Capital Equipment & Materials Sales Representative Company, established in 1986. West Coast USA, National and World Wide sales, service and marketing experience.
- Marubeni International Electronics Corporation MIE identifies worldwide sources of supply for capital equipment, or system components, that can meet the ever-changing business needs of customers worldwide. Since its incorporation in 1974, MIE has explored and found new markets and products in the U.S., Japan, Southeast Asia, and other countries to meet these dynamic needs.
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