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Semiconductor Test, Assembly & Packaging :IC Device Packaging :Packages-Ceramic/Plastic
     

  • Honeywell Electronic Materials serves the electronics industry with material and service solutions used in the production of semiconductor devices, advanced packaging for silicon chips and amorphous alloy products.  

  • PSi Technologies, Inc. is engaged in high-volume contract Assembly and Final Testingof variuos Power Packages that provide 'Total Solutions' through its Advanced Technology capability.  

  • IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.  


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