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Semiconductor Test, Assembly & Packaging :Bonding Wire/Tools
     

  • ANZA TECHNOLOGY, INC was founded in 1978 as a closely help corporation. The emergence of the IC chip industry unveiled a definite need for testing of the industry methods of Die Attach as well as Lead Fatigue and Bond Pull. These needs led directly to the formation of the ANZA TECH Test Division to address these critical areas. Most of these machines are still in operation around the globe, needing only periodic recalibration.  

  • Uthe Technology has been the acknowledged leader in the design and manufacture of ultrasonic generators and transducers for ultrasonic and thermosonic wire bonders.  

  • TEXMAC is a distributor of electronic assembly and test equipment.  


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