- Epoxy Technology was founded in 1966 as the world’s first supplier of electrically conductive epoxies for use as die-attach adhesives in hybrid microelectronics, semiconductor packaging and assembly. Chemical engineer Frank W. Kulesza, our President, first formulated these precious-metal-filled materials as a consultant for IBM.
- AI Technology Inc. adhesive technology for electronics packaging in 1985, AI Technology (AIT) has been one of the leaders in the development and production of innovative material solutions.
- IPAC ( Integrated Packaging Assembly Corporation ) delivers surface mount packaging assembly services and offers a vast portfolio of QFP, BGA, CSP, Molded Array and Custom Packages . Our focused teams adhere to IPAC's strict quality control practices at each phase of design and manufacturing—ensuring that only the highest qualityproducts leave our IC package foundry.
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