- Semiconductor Equipment Corp. Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing. There is a Semiconductor Equipment Tape that is perfect for your application.
- Wadsworth-Pacific Furukawa's line of ultra-violet release tapes for semiconductor wafer backgrinding and dicing offer yield enhancement and possibilities heretofore not possible with conventional processing. specializing in leading-edge materials for semiconductor fab, assembly and packaging. Leadframes, packaging and assembly tooling of all kinds, plastic shipping rails and leadframe packaging, UV dicing and backgrinding tape.
- CHIPS, ( Component Handling Inspection Packaging Services, Inc. ) offers unparalleled quality, fast turnaround and competitive pricing in wafer thinning, dicing, sawing, die sort and load, and visual inspection. We also offer substrates and wafer grinding, polishing, lapping, glass and sapphire cutting, wafer inspection, bumped wafers and more... If you are a semiconductor manufacturer , fabless semiconductor house , IC design house , producer of MCMs, hybrid modules, COBs, CSPs, Flip Chip BGA s , contract assembler or , chip distributor - If you need wafer to die...
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