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Semiconductor Test, Assembly & Packaging :Materials Back-End :Lead Frames
     

  • Jade will design and build to customer requirements or build to print from customer documentation. We also offer Electromechanical Sub-assembly, combining machined parts, cable assemblies, stamped components, electrical and pneumatic controls. Short runs and bonding services using the Jade developed Thermocompression Bonding Process : ILB, OLB, & lead attach, are a specialty.  

  • Die-Tech builds solutions to connection problems for manufacturers who are committed to continuous improvement of their process and product. As a vertically integrated company, Die-Tech has been a long-time leader in precision metal stampings, specializing in the design and manufacture of lead frames and lead assembly equipment. Die-Tech's automation group provides application equipment from hand tools to fully automatic manufacturing lines. Other services are product design and prototyping, connector assembly and contract manufacturing of microelectronic packages.  

  • PSi Technologies, Inc. is one of the biggest contract assembly sources certified to produce time-proven packages. These packages provide 'Total Solutions' through Advanced Technology. The aim is to develop packages that match the customer's die technology and specific application requirements. PSi has a dedicated Design Team that utilizes Computer-Aided Design (CAD) technology. Parallel with the task of designing packages that match the customers' die technology and specific application requirements, the Design Team interfaces with customers to ensure consistent quality in the various package development stages.  


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