- Silicon Valley Microelectronics, Inc. Provider of silicon wafers, wafer processing and JEDEC style shipping trays.
- Micro-Swiss Solder Spheres (known also as Solder Balls), are used to interconnect array package types such as BGA, CSP and Flip Chip types. They are used in the last part of the assembly line after Molding.
- Tempo Electronics, has developed and demonstrated a new process for flip-chip assembly using SurftapeŽ (for details click here). This combined with SurftapeŽ's conventional usage means you have the ultimate turn-key solution for your assembly process. You essentially get the best of both worlds; direct-chip-attach or chip-on-board, all from one tape and one feeder with no modifications.
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