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Semiconductor Test, Assembly & Packaging :Environmental Test Equipment :Sockets/Adapters
     

  • Hypertronics Corporation Hypertac ®(HYPERboloid conTACt) is an advanced design that satisfies performance requirements previously considered impossible. The shape of the sleeve is formed by wires strung at an angle to the socket's axis. Low Insertion - Extraction Forces: The controlled angle of the socket wires allows tight control of the pin insertion and extraction forces. The spring wires are smoothly deflected to make line contact with the pin.  

  • WELLS-CTI Wells to form a major supplier of interconnect devices for the Global Integrated Circuit ("IC") Industry. WELLS-CTI offers a total IC interconnect solution with its complete line of burn-in sockets and growing line of test, development, and production sockets.  

  • TI Burn-in Test Sockets, providing customers with burn-in and test socket solutions worldwide. TI's Interconnection business creates custom-engineered and core testing solutions for the semiconductor and electronics industry to ensure quality, boost yield and increase productivity. TI is accelerating design, manufacturing and assembly techniques, and advancing new chip packaging technologies.  

  • Loranger has over 25 years of experience manufacturing sockets and printed circuit boards for the test and burn-in. Several thousand socket designs include: BGA, MicroBGA, LGA, PGA, LCC and Kelvin SOIC. Printed circuit boards include Dedicated Burn-in Boards, Universal Socket Design Boards, test fixtures, and adapter assemblies.  


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