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Semiconductor Wafer Processing :Process Equipment :Epitaxy
     

  • AFS's strength is its ability to design and manufacture a dynamically controllable damper using the capabilities of Smart fluids. These dampers have a wide range of applications, e.g. seats in off-road vehicles, car suspension systems, mountain bike shocks, aircraft simulators and many industrial requirements which have to date been limited by the performance constraints of conventional passive dampers. .  

  • Marubeni International Electronics Corporation MIE identifies worldwide sources of supply for capital equipment, or system components, that can meet the ever-changing business needs of customers worldwide. Since its incorporation in 1974, MIE has explored and found new markets and products in the U.S., Japan, Southeast Asia, and other countries to meet these dynamic needs. .  

  • Tystar Corporation began its operation in 1988 with a team of experts, bringing together more than 40 combined years of experience in semiconductor equipment and process technology. Tystar is dedicated to the design and manufacture of quality equipment and controls for the semiconductor and fiber optics industries. Tystar equipment offers superior performance and cost effective solutions and has become widely accepted as reliable tools for production and R & D applications..  

  • Tru-Si Technologies is the world leader in manufacturing its proprietary Atmospheric Downstream Plasma (ADP) equipment for semiconductor wafer processing applications. The ADP equipment enables leading semiconductor companies to open the next dimension in reducing sizes of chips and meet the increasing market demands for thinner packages. The ADP, isotropic dry-etching technology, also eliminates backside stress and damage. The company's products target high-density and high-performance chip markets such as smart cards, hand-held devices and workstations. .  


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