- Engis manufactures superabrasive finishing systems throughout the world. Products include Hyprez diamond powders, slurries and compounds, flatlapping and polishing machines, Electrogrip electroplated cutting tools, bore finishing machines and tools..
- Fancort Industries is a New Jersey manufacturer and distributor of production equipment and production accessories used in electronics manufacturing. The equipment is for two distinct areas of manufacturing--circuit board assembly and semiconductor assembly. .
- Lapmaster International to solve the most challenging precision finishing problems. With over 50 years of experience, Lapmaster has a proven history of successfully developing cost effective processing solutions for virtually any application. .
- Tanaka Syatems Inc. TSI sells directly to end users. It has the largest U.S. market share for ID diamond saw blades for slicing-crystal silicon ingots into wafers. TSI is also a leading marketer of silicon wafer edge-grinding and back-grinding wheels, wafer DicingBlades, tab bonding tools and various sized and configured diamond wheels for semiconductor materials. TSI’s latest product launch is CMP Pad Conditioner..
- WESGO Technical Ceramics Division, part of Morgan Crucible Group spanning the world with 140 subsidiary companies, has been the premium supplier of custom ceramic components for chemical, electrical, mechanical, and vacuum applications. .
- CHIPS Components Handling Inspection Packaging Services, Inc. CHIPS' DIE SAW / WAFER DICING capability for 8 inch diameter silicon wafers, 6 inch gallium arsenide wafers and bumped wafers. We chip IC, wafer die inspection, wafer thinning, dicing, map decoding and more... CHIPS runs its saws on three shifts for fast turnaround. Our Saw Team of highly trained operators precisely adjusts saw and wafer cutting speeds for best output consistent with cleanly cut edges (kerf). We focus on this value added business produces a quality level in cleanly cut, particle free wafers and die, unparalleled in the industry....
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