- GEL-PAK has recently developed a new series of wafer carriers that are designed to provide a damage free environment for handling, shipping and storing final production wafers, partial wafers or diced wafers on tape and frame.
- CHIPS, Inc. DIE SAW / WAFER DICING capability for 8 inch diameter silicon wafers, 6 inch gallium arsenide wafers and bumped wafers. We chip IC, wafer die inspection, wafer thinning, dicing, map decoding and more... CHIPS runs its saws on three shifts for fast turnaround. Our Saw Team of highly trained operators precisely adjusts saw and wafer cutting speeds for best output consistent with cleanly cut edges (kerf). We focus on this value added business produces a quality level in cleanly cut, particle free wafers and die, unparalleled in the industry...
Sponsored
Links
|
|
Employment
Opportunities
Facilities Program Manager
with semiconductor experience
Field Applications Engineers
Taiwan, China, Japan, India, San Diego
Process Engineer
Mountaintop, PA
Test Engineer
San Jose
Customer Engineer I 6210
TEXAS CE - Technical Support
Product Marketing Manager 7960
Santa Clara
College Interns 1000
Applied Materials
more... |
