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Semiconductor Test, Assembly & Packaging :Assembly / Hybrid Equipment :Soldering & Brazing
     

  • Centrotherm systems were designed for large area reflow soldering of power semiconductor chips on DCB (direct copper bonding) Al2O3 substrates or DCB on baseplates. In comparison to the reflow soldering in conveyor furnaces voids can be decreased from 10..20% to 1...2% typical even using pure H2.  

  • GPD precision high speed dispensing equipment, advanced circuitry material handling equipment, aqueous cleaners, thru-hole & SMT component lead forming & tinning, SMT component testing & packaging systems, pick & place.  

  • ENGELHARD-CLAL is a world leader in refining, manufacturing and marketing of precious metal products.  


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