- Quad Systems Ball grid arrays (BGAs) are emerging as the package of choice for high pin count, high clock frequency integrated circuits and high density printed wiring boards. The electrical, thermal, and mechanical characteristics of this package give it considerable advantages over its predecessor, the fine pitch quad flat pack (QFP). What new capabilities a pick and place machine must provide to deliver the alignment and inspection benefits that printed wiring assembly manufacturers require.
- Seiwa Optical Co.Ltd. formed as a microscope manufacturer, Seiwa has expanded into the Computer Vision/Machine Vision industry and continues to be on the forefront of vision technology.
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