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Semiconductor Test, Assembly & Packaging :Assembly / Hybrid Equipment :Ovens Cure/Heat/Anneal
     

  • Alphasem is one of the world’s leading manufacturers of Die Attach Systems. Die Attach Systems are used to attach the semiconductor chips - tiny little electronic control modules - to their protective packages. The chips convert relatively simple mechanical systems for daily use into high performance products.  

  • Research Inc. is the provider of controlled heating solutions. Infrared, IR, heat, silicon, heater, spot, line, panel, area heater, chamber, clamshell, electric infrared heat, solar simulater, T3 lamps, controlled heat, parabolic, drying, paint, ink, adhesives, plastic, soldering, solder, ceramic, high density, near infrared.  

  • SierraTherm Production Furnaces is a world leader in the design and manufacturing of thermal processing and wafer photoresist coat/develop equipment, which includes:  

  • Timken Aerospace and Super Precision Bearings (MPB Corporation) produces super-precision and miniature bearings. It has the capability to design and manufacture any standard-or advanced-design ball or cylindrical roller bearing. These bearings are used in aircraft and missile guidance systems, jet engines, satellites, computer disks, x-ray tubes and other high-technology applications.  

  • Tiros Corporation Thermal Solutions that will meet your processing needs ...family of ovens supports continuous inline curing and process flexibility by using variable quantities of chambers.  

  • Cascade TEK Forced Air and Vacuum Ovens are designed to meet the most critical constant temperature requirements of industry. In a wide range of sizes - from small bench top to large floor models - these ovens are ideally suited for drying, curing, sterilizing, life-testing and other applications requiring uniform & precise temperature and control.  


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