- ASM provides equipment for front-end or wafer processing, in which wafer substrates are layered with numerous semiconductor devices, and provides equipment and materials for back-end processing, in which wafers are separated into individual integrated circuits that assembled, packaged and tested. The Company is the only major semiconductor capital equipment manufacturer to ....
- ESEC Group As a leading manufacturer of Die and Wire Bonders and as the only supplier of fully-automated assembly lines, the company plays a major role in shaping the technological standards of its markets. The ESEC Group is market leader worldwide with assembly systems, which provides solutions for future technologies such as chip scale packaging and flip chip applications. The Group's activities are rounded off by a production line for manufacturing smart cards and a new process for packaging chips.
- Micro-Mechanics designs and manufactures tooling for semiconductor packaging. The company’s products include replaceable rubber tips, high temperature plastic pick-up tools, carbide die collets, ejector needles, adhesive dispensing nozzles, wirebond clamps and precision custom tooling.
- Sumitomo Heavy Industries,Ltd. (SHI) is an integrated manufacturer of industrial machinery, ships, bridges & steel structure, equipment for environmental protection, including recycling, power transmission equipment, plastic molding machines, laser processing systems, particle accelerators, material handling systems, etc.
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Facilities Program Manager
with semiconductor experience
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Taiwan, China, Japan, India, San Diego
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Mountaintop, PA
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Santa Clara
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