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Semiconductor Test, Assembly & Packaging :Assembly / Hybrid Equipment :Marking Machines/Imprinting :Leadframe Taping
     

  • ESC International Automatic Wafer Changer, Selectable Multiple Magazine or unstacker onload on the same machine, Gripper system for BGA or substrate feeding through the indexer. High Speed epoxy writing with positive displacement system, Bond line thickness repeatability to .0005, Wafer mapping using SEMI SECS-II, communications protocol, and Advanced pattern recognition for pre and post bond inspection with programmable zoom feature.  

  • UBE Supporting industry and society, each of UBE's wide array of plastics, synthetic rubber, and basic and fine chemicals encapsulates the essence of the Company's venerable technologies of revolutionary developments of new products, UBE continues to challenge the limits of possibilities in the world of chemicals.  

  • Precision Technologies PTI has been designing and manufacturing precision semiconductor equipment and tooling since 1987. Equipment lines include lead conditioning systems and related tooling for semiconductor IC package repair, video micrometer coplanarity inspection and measurement systems, trim and form systems and related tooling and encapsulation molds.  

  • ICOS a vision company offering industrial vision systems for many applications such as coplanarity and mark inspection on integrated circuits, geometry inspection of pressings, connectors and semiconductors, measurement and inspection of screws and quality control of pressings and lathe turnings.  


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