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Semiconductor Test, Assembly & Packaging :Assembly / Hybrid Equipment :Lead Finishing/Straighteners/Trimmers
     

  • APIC Yamada trimming and forming machine, developed from the tie bar cut-off machine, the world's first unit to automate the lead-processing function, utilizes our own original mechanisms, control system, and precision stamping dies to perform lead-pin processing with ultra high precision.  

  • Dana Design works closely with customers to develop specalized production and inspection techniques to ensure performance and accuracy in every product.  

  • EVER TECH Our core business is in the design and manufacture of automated equipment and precision parts for the semiconductor industry. Vision Inspection Systems incorporating Lasermark, Lead Conditioning and Tape & Reel options. The SR Series incorporates Mark & Lead Inspection with Lead Conditioning and Tape & Reel as optional add-on processes. These systems provide optional Tube or Tape & Reel Output. Lasermark capabilities are available option. The SR Series cater to practically all your Electrical Test requirements for Total Integrated End-of-Line IC Manufacturing.  

  • NTK Technical Ceramics Leadless Chip Carrier (LCC) Traditional JEDEC type leadless chip carriers as well as recently popular crystal and SAW packages are derived from this surface mount type package group. Some charge coupled devices (CCD) are mounted in the modified leadless chip carriers.  

  • Ismeca This division manufactures products which are for assembly and packaging of devices in semiconductor plants all over the world. From stand alone systems to complete integrated lines, our wide range of equipment provides the best solutions for Back-End processes.  


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