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Semiconductor Test, Assembly & Packaging :Assembly / Hybrid Equipment :Die Bonding
     

  • 3S-Phoenix, Inc. is a maker of custom semiconductor manufacturing equipment. We have provided custom automated assembly solutions to customers around the world. Specializing in high speed die attach and pick & place equipment.  

  • Uthe Technology has been the acknowledged leader in the design and manufacture of ultrasonic generators and transducers for ultrasonic and thermosonic wire bonders. The principal markets for the company's equipment are merchant and captive semiconductor manufacturers. More than 70 percent of Uthe products are sold to original equipment manufacturers and distributors, with the remainder being sold to end-users.  

  • ICOS has become a world-wide industry standard for the visual inspection of semiconductor components, as well as the alignment of SMD devices during the PC board assembly. With the acquisition of Qtec in 1998, ICOS extends its product assortment into leadframe inspection and some automotive applications.  

  • Quad Systems Corporation is a multi-national company that designs, manufactures and supports surface mount equipment, and related peripherals and services in the manufacture of printed circuit boards (PCB). In this process, electronic components are soldered to the surface of a PCB. The first step in this process is to deposit solder paste, a mixture of small metal spheres and a solvent system onto the interconnect pads of the PCB. Next, the components are placed on top of the board by a placement system. Finally, the assembly is passed through a reflow oven to heat the PCB, solder paste and components to create an electrically sound intermetallic bond between the PCB and components.Electronic Assembly Process & Productivity Solutions.  


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