- Logitech is a Scottish-based manufacturer of high precision cutting, lapping and polishing equipment. Logitech equipment is in research laboratories to prepare crystalline materials such as silicon, gallium arsenide, lithium niobate, laser rods, quartz and geological materials for a variety of applications. All these applications share a requirement to produce thin, flat, parallel and highly polished components.
- Manufacturing Technology, Inc . (MTI) is known worldwide as a leading-edge manufacturing company, dedicated to the design and production of state-of-the-art, high performance, ultra precision machine systems for slicing, slotting, dicing, grinding and lapping operations.
- Okamoto Corporation Line-up products have been developed to fill user's needs arising in the throughout process of the brittle material from ingot to chip by use of fixed and free abrasive grain. They pursue the world of further PLANARIZATION toward the twenty-first century.
- Dynatex International Applications - Wet Saw Die Separation-Dynatex International, semiconductor, wafer dicing, wafer seperation, materials, equipment, gallium arsenide, silicon, diodes...
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