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Semiconductor Test and Measurement :Analysis/Measurement :Surface Inspection/Flatness
     

  • UBM Corporation is a manufacturer of laser measurement and inspection equipment to analyze package flatness, substrate warpage, BGA structure, MEMS form, flip chip warpage, thick film height and surface finish. UBM measuring systems help improve yield, productivity and quality in diverse industries including Semiconductor, Automotive, MEMS, Aerospace, Electronics, Data Storage and Medical ...  


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