- MECO EQUIPMENT ENGINEERS Interposer Singulation System, FEATURES: Product pick-up at the mold cap side with vacuum chucks for every product. Extremely accurate positioning of the products versus the saw, using the pads, bumps or markers as vision reference. No mechanical adjustments: auto-calibration of the pick-up head with the assist of the vision system.
- Westar ’s designs, manufactures and sells automatic equipment to singulate, sort, and inspect semiconductor die. Westar’s product offering also includes a line of Dicing Saws, Wire Bonders and other systems.
- Manufacturing Technology, Inc. ( MTI )'s NSX Series is establishing the future standard for CSP and fiber reinforced package singulation. Additionally, these dicing systems are ready for the transition to the 300mm era and beyond.
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