- SpeedFam-IPEC Chemical Mechanical Planarization (CMP) Chemical Mechanical Planarization is used during the semiconductor manufacturing process to planarize individual layers in complex integrated circuits to customer specific parameters.
- Strasbaugh CMP Systems, the first name in high-productivity CMP, sets the standard for chemical mechanical polishing systems.
- Lapmaster offers a variety of specialty lapping and polishing machines for various applications.
- EBARA CORPORATION Our Semiconductor Equipment Division is the world-wide leading supplier of Chemical Mechanical Polishing systems (CMP) that are installed in Semiconductor Production and Pilot line facilities.
- Okamoto Corporation In order to meet with multifunction of semi-conductor devices such as LSI, VLSI and ULSI, it is required to grind, with high accuracy, highly integrated circuit on which multiple layers of wires are printed. The CMP has been developed to respond to such planarization. CMP of Okamoto, being equipped with the special structure in the head and clamping mechanism, can stably process wafer with high throughput and high accuracy.
- Rodel CMP consists of a chemical process and a mechanical process acting together to reduce topography (height variations) across a dielectric region, clear metal deposits in damascene processes, or remove excess oxide in shallow trench isolation fabrication. See products CMP... Copper - s1-Polishing, and Tungsten Buff- 30H50.
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