- Novellus Fundamentals of Copper : The articles discuss the details of electroplating and the varieties of damascene, both important fundamentals in the Metalmorphosis to copper. In the case of electrodeposition of copper onto a silicon wafer, the wafer is typically coated with a thin conductive layer of copper (seed layer) and immersed in a solution containing cupric ions.
- Electroplating Engineer of Japan Ltd. Delivering customer satisfaction through environmentally sound, user-friendly systems. The combination of CUSBIS & MICROFAB Cu Series is EEJA's answer for an advanced copper deposition system for sub-micron patterning.
- Rodel has become a global leader in precision surface technology. Chemical Mechanical Polishing (CMP) is one of the most powerful advancements in the production of semiconductor devices in recent history.
- Semitool revolutionary, fully automated platform for high throughput production of copper interconnects has arrived.
- Applied Materials The interconnect is the multi-layered maze of "wiring" in a chip that connects the millions (soon to be billions) of transistors. More than half of the total process steps in chipmaking are used to build the interconnect, using a complex matrix of insulating (dielectric) and conducting films.
- Taiwan Semiconductor Manufacturing Company is the world's largest dedicated foundry. TSMC leads the industry in fab capacity and manufacturing technology. Available processes include logic, mixed signal, high voltage, image sensor, embedded DRAM, embedded FLASH and copper at linewidths from 0.35µm to 0.25µm. 0.15µm and 0.13µm technologies are in development as is TSMC's first 300mm fab. TSMC also provides access to the most robust collection of IP and libraries and offers complete design services to shorten customer time-to-market.
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