- Intel Corp. This white paper briefly reviews thermal impedance definitions and the measurment technique used for thermal characterization and discusses the thermal characteristics of the 100 lead PQPF, and the 168 and 208 pin ceramic pin grid array packages under both static and moving air conditions. Different heat fin designs and their impact on improving package thermal performance are examined. PGA - IC Packages: Thermal Management Data
- Micrel Semiconductor Thermal Management Data Sheets - MIC502 Fan Management IC - Application Notes and Hints - 34 Fan Health Monitoring and the MIC502
- Dallas Semiconductor Thermal Management Applications: Thermostatic controls, industrial systems, consumer products, thermometers, or any thermally-sensitive system
- Maxim / Product Tree - Thermal Management Temperature Sensors and Switches - SMBus Remote/Local Temperature Sensors - Remote Temperature Sensor and Fan Controller - Temperature Threshold Switches
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