- Remtec provides an ideal solution for electronic packaging and assembly. The most typical applications are assembly of surface mount components (especially power SMC), chip-on-board (COB) applications and chip scale packages (chip carriers, flip chips, BGA). Additional applications include SMT multichip modules (MCM), chip carriers and packages for direct pc board mount as well as hermetic power packages integrating multiplayer substrate with plated copper and hermetic vias into a package base (ISP, or Integral Substrate Packages).
- Global Chip Materials is an independent distributor of ceramic IC packaging materials. We stock virtually every type of ceramic package available - all in the most common sizes and configurations and open-tooled designs. No matter how large or small the requirement, we offer a reliable way to shorten lead times and reduce cost of materials. Our staff of packaging experts together with our online technical data will help you solve your packaging needs faster and easier than ever before.
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